Bonding wires

TANAKA Bonding wires are used for a wide range of products, such as integrated circuits (ICs and LSIs) and transistors. It allow to connects semiconductor IC chips to electrode.

All of our bonding wires are delivered with a specific certificate of analysis. 


Other existing forms by clicking below

Please specify the length and the number of spools required on the quantity box and refer to all technical information on the pdf file above. 

Material Ø Wire
Gold bonding from 15 ±1 µm to 38 ±1 µm
Gold alloy from 15 µm to 30 µm
Copper from 15 ±1 µm to 500 ±10 µm
Aluminum (for power devices) from 100 ±5 µm to 500 ±10 µm
Aluminum-Silicon from 18 ±1 µm to 80 ±3 µm
Silver Alloy from 15 µm to 30 µm
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