Silicon wafers are cut from Silicon single crystal using internal diameter diamond discs. They are used for production of silicon substrates and membranes.
The below mentioned parameters are dealing with our standard products.
On the customer's request we are ready to discuss orders for wafers with some other parameters. All of our silicon wafers are delivered with certificate of analysis.
Direct link to the wafers tweezers page : tweezers
Main specifications for our wafers in stock:
We can offer wafers with some other parameters. Please fill in the table "Our customized products", with your specifications.
We offer a service of thermal oxidation (by dry or wet way) on our wafers (or on your wafers). The oxidation thickness can be from 50 nm to 5 µm. The oxidation on one side is also possible.
We offer a service of silicon nitride Si3N4 (classical at 800°C or low stress at 835°C) of our wafers (or your wafers).
Thickness: from 50 nm to 1 µm.
We offer special vacuum coatings (Ag, Al, Au, Cu, Pt, ...) on wafers by PVD (sputtering or vacuum evaporation). We can deposit a precoating layer (Cr or Ti) if necessary.
We can also offer multi-layers deposition.
We offer the dicing of the wafers in square or rectangular parts.
If you want an offer, or for more information about this product: Contact usContact us
Single Silicon wafer carrier, or for other delicate flat substrates, from 1" to 6".
Material : natural PP
Couleur : Transparent